Analisa Ketebalan Lapisan Menggunakan Spectroscopic Ellip-sometry (SE) pada Cu, Mo, dan Zn Yang Dideposisikan Diper-mukaan Substrat Silikon dan Substrat Kaca

Ummu Kultsum, Robi Kurniawan

Abstract


Penelitian ini dilakukan untuk analisa ketebalan lapisan tipis pada substrat Silicon (Si) dan substrat kaca. Lapisan dideposisikan menggunakan alat DC Magnetron Sputtering dengan target yang berbeda yaitu Tembaga (Cu), Molibdenum (Mo) dan Seng (Zn) dalam suasana gas Argon (Ar) yang dialirkan dengan kecepatan 40 sccm, tekanan 1 Pa, dan daya 100W. Ketebalan lapisan tiap target diukur menggunakan alat Spectroscopic Ellipsometry SpecEI-2000 dengan panjang gelombang 191–1690 nm dan diperoleh nilai ketebalan untuk Cu antara 19.14-51.45 nm, Mo antara 27.08-42.19 nm dan Zn antara 10.22-88.45 nm. Dari hasil XRD juga menunjukkan bahwa puncak difraksi substrat Si dan substrat kaca masih terbaca dan menunjukkan 1 puncak utama dari target Cu yaitu pada posisi puncak 2?=43.2?, target Mo pada posisi puncak 2?=40.3? dan target Zn pada posisi puncak 2?=44.9?.

Kata Kunci: elipsometer, magnetron sputtering, ketebalan, lapisan tipis


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References


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DOI: https://doi.org/10.56064/jps.v26i3.1081

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